This equipment is mainly used for stripping and cleaning the sliced wafer rods. It can automatically separate wafers, perform a series of operations of singulation, cleaning, and loading into the cassette.
The specially designed loading device can be directly processed with the wafer rod tray of each company's slicer
Can correspond to various water-soluble or oil-based cleaning fluids. After the washing liquid is specially filtered, it can be used repeatedly. Greatly reduce the cost of use
High processing speed
A variety of additional functions can be selected: wafer surface text marking, automatic inspection of residual glue around the wafer, wafer flip filling, cumulative filling, etc.
Equipment operation process: