• Description:

This equipment is mainly used for stripping and cleaning the sliced wafer rods. It can automatically separate wafers, perform a series of operations of singulation, cleaning, and loading into the cassette.

Product Features:

The specially designed loading device can be directly processed with the wafer rod tray of each company's slicer

Can correspond to various water-soluble or oil-based cleaning fluids. After the washing liquid is specially filtered, it can be used repeatedly. Greatly reduce the cost of use

High processing speed

A variety of additional functions can be selected: wafer surface text marking, automatic inspection of residual glue around the wafer, wafer flip filling, cumulative filling, etc.

Equipment operation process: