• Description:

Dual-axis Wafer Edge Grinding Machine (box of 8 pieces)

Corresponding to 12inch's best-selling W-GM series mass production machine

Simultaneous control of X-axis, Y-axis, Z-axis, and θ-axis for high-precision grinding machining

Can realize the measurement and automatic correction of grinding results

Product features:

Corresponding materials: various compounds such as silicon and glass, various crystalline materials, and various sintered materials

Optional functions: notch processing, low distortion grinding, HOST communication

Processing station: 2 stations

Supply storage: 8-piece box