• Description:

Dual-axis Wafer Edge Grinding Machine (box of 4 pieces)

Corresponding to 2~8inch W-GM series mass production machines

Multiple icons and easy-to-operate touch screen mode and high-quality graphics

Processing objects: silicon, SiC, LT, LN, GaAs and other advanced materials

product features:

Corresponding size: 2~6, 4~8inch two specifications

Corresponding materials: silicon, SiC, GaN, LT, LN, GaAs, glass and other compounds, various crystalline materials, and various sintered materials

Optional functions: notch processing, low distortion grinding, HOST communication

Processing station: 2 stations

Supply storage: 4-piece box, 8-piece box, 12-piece box